Stripping and etching continuous stripping wire (SES wire)
Equipment process:
Entering the board T filming T flushing sewage T overflow water washing (1) (2) (3) T high pressure water washing T overflow water washing (4) (5) T clear water entering T inspection T compensation etching T etching T sub-liquid washing T overflow Flowing water washing (6) (7) (8) T clear water in T inspection T stripping tin T overflow water washing (9) (10) (11) (12) T clear water in T dry board combination T board out
Equipment Specifications:
Equipment external size: 21350mm(L) * 2500mm(W) * 2500±25mm(H) (Production speed is roughly proportional to the length of the equipment)
PCB board specifications: i) 610 mm * 610 mm [Max]
ii) 200 mm * 200 mm [minimum]
iii) 0.3～3.2 mm [thickness] [standard configuration: 55 wheelbase]
iV) 0.1～3.2 mm [Thickness] [Customized: 35 wheelbase]
Production speed: 0.6～8m/min (adjustable) [Working productivity preset to: 2.5m/min]
Features:
1. Removal film cross oblique spraying spray can more effectively wash away the clean film;
2. Cone drum type membrane slag separation system can collect and process membrane slag efficiently and cleanly;
3. Precisely compensated etching design, effectively controlling the pool effect, improving board uniformity, etching line width and line spacing: 3mil/3mil, etching uniformity C.O.V≥96%, etching factor ≥5.